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Brand Name : HF
Model Number : Rigid Flex RPCB
Certification : ISO CE
Place of Origin : China
MOQ : 5PCS
Price : Negotiable
Payment Terms : L/C, T/T,PAYPAL
Supply Ability : Ten thousand square meters per month
Delivery Time : 5~8 days
Packaging Details : Vacuum packing, high quality carton
Base Material : FR4 ,Rogers , Aluminum ,Hight TG
Number of plies : 2-4-6-8-10-12-16-20-22-28 Layer
Board Thickness : 0.4-4.0mm
Copper Thickness : 1-6oz
solder Color : green,Red,Black,Yellow,White,Blue
silkscreen color : white,black,yellow
surface Finishing : HASL(lead Free) / Immersion Gold /osp / Immersion tin/Immersion silver
Min. Hole Size : 3mil
Service : OEM Services Provided,PCB/Components Sourcing/Soldering/Programming/Testing..,One-stop Turnkey Service,One Stop Turnkey service,PCBA
Material : FR4 ,Rogers , Aluminum ,High TG,CEM1, CEM3, Halogen Free
Layer Coun : 1-40
Solder Mask color : green, yellow,white, blue,black,red
Surface Finishing : HASL(lead Free) / Immersion Gold(ENIG) /OSP/ Immersion Tin/Immersion Silver
Test : 100% AOI, X-ray, Flying probe test.
Capability
| High precision prototype | PCB bulk production | ||
| Max Layers | 1-28 layers | 1-14 layers | |
| MIN Line width(mil) | 3mil | 4mil | |
| MIN Line space(mil) | 3mil | 4mil | |
| Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm | 
| Board thickness≤2.5mm | 0.2mm | 0.3mm | |
| Board thickness>2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Board thickness | MAX | 8mm | 7mm | 
| MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
| MAX Board size | 610*1200mm | 610*1200mm | |
| Max copper thickness | 0.5-6oz | 0.5-6oz | |
| Immersion Gold/ Gold Plated Thickness | Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u” | ||
| Hole copper thick | 25um 1mil | 25um 1mil | |
| Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% | 
| Outline Tolerance | ≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm | ≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm | |
| Impedance | ±10% | ±10% | |
| MIN Solder mask bridge | 0.08mm | 0.10mm | |
| Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm | |
Applications:
 Communications
 Traditional telecommunication equipment, FTTP, VOIP, multimedia services, data networking and IT infrastructure products, wireless infrastructure products, power amplifiers, splitters and combiners, high power transistors, etc.
Computer Peripherals
 High end printers, cable modem, wireless routers, IP telephones, consumer and office products, banking system etc.
Consumer
 Computers, televisions, cameras, digital video recorders (DVR), handheld products, LED, etc.
Automotive
 Passenger safety systems, engine control systems, air bags, traction control products, etc.
High End Computing and Storage
 High performance computer and server, mainframe system and storage equipment, memory, etc.
Industry
Power supply, main control panel, monitor, CCTV products,automotive control equipment, industry robot, access control products etc
Medical
 Magnetic resonance imaging (MRI), computed tomography (CT), emergency response defibrillation units, patient monitoring, implantable devices, robotic surgery systems, biometrics and diagnostic equipment, etc.
Military
 Satellite, radar, airplane, control unit, communication equipment .etc.
Test & Measurement
 Power meters, electricity tester, thermal tester, light tester, network tester, gas and oil tester, infrared products, semi-conductor test equipment, DUT and probe cards, wafer inspection systems, etc.

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